Citation

Tian Y, Cheng G, Guo J, Zhou L, He L, Ye H. Advanced Engineering Materials 2007; 9(11): 963-966.

Copyright

(Copyright © 2007)

DOI

10.1002/adem.200700141

PMID

unavailable

Abstract

The microstructure of the DS alloy is composed of (Nb, Ti)ss matrix, (Nb, Ti)5Si3, (Ti, Nb)5Si3 and a small amount of Ho2Hf2O7. The microstructure of the DS sample is coarser than that of the CC sample due to the slower solidification rate of the former. The typical microstructure of the longitudinal section shows that the lamellar suicide phases are aligned parallel to the growth direction and embedded within a (Nb, Ti)ss matrix. The high-temperature compressive yield stress and room-temperature fracture toughness of the DS alloy are higher than those of the CC alloy. The fracture exhibits a mixed fracture mode in the DS alloy. However, the transgranular cleavage is the predominant fracture mode in the CC alloy. © 2007 WILEY-VCH Verlag GmbH & Co. KGaA,.

Language: en

Keywords

High temperature effects; Microstructure; Mechanical properties; Solidification; Niobium alloys; Room temperature; DS alloy; Holmium alloys